Gotham Silicon

A new batch of test chips is currently undergoing the ion diffusion furnace process. These chips will be tested tomorrow to assess the impact of a recent nitrogen valve failure, which caused a deviation from the expected atmospheric conditions within the furnace.

If the tests are successful, we will proceed with testing the metal contacts to the source, drain, and gates of the transistors. However, if the chips have been compromised, a new batch will need to be fabricated.